Electrically conductive adhesives likely to grow in importance

Electrically conductive adhesives (ECAs) are set to become a key conductive joining technology across several industries, such as flexible electronics, in-mould electronics, and wearable technologies.

A new report from IDTechEx predicts the ECA market will be worth US$3.67bln by 2032. ECAs can be used to connect components and circuitry across a range of uses, giving joins which are mechanically strong and electrically conductive. Due to the restricted use of lead-based solders, new alternatives are needed to fill the gap in the market, and IDTechEx believes that, despite some drawbacks, ECAs are one of the most promising alternative options.

Drawbacks include high costs compared with other joining technologies, primarily due to high materials and processing costs, as well as a lack of self-alignment for components.

Electrically conductive adhesives consist of two components: the conductive filler, and the structural resin. The filler creates the conductive link across a join. Fillers are typically metal based, with the most common metal being silver. The resin provides mechanical strength to the adhesives and holds the filler particles in place. Resins are generally polymer based, with epoxy being the most common option.