Newport & Cardiff Materials Society (NCMS)

Dive into the intricate realm of semiconductor packaging materials with Dr. Jayakrishnan Chandrappan as we unravel transformational advanced packaging technologies and their diverse applications. Semiconductors form the backbone of modern technology. They power an extensive array of electronic devices essential which are essential to daily life. From smartphones and laptops to medical equipment and automotive electronics, semiconductors enable innovation and connectivity on a monumental scale.
At the heart of semiconductor manufacturing lies the critical process of packaging, which involves the encapsulation and protection of semiconductor chips. These tiny electronic components house millions of transistors and demand meticulous care, to ensure seamless integration and functionality in electronic systems. Beyond physical protection, the packaging process enables crucial electrical connections and efficient thermal management. In high-power applications, effective thermal regulation is paramount for dissipating heat and ensuring optimal device performance and reliability.
The emergence of advanced packaging technologies, including 3D packaging and System-in-Package (SiP), has revolutionised the semiconductor industry. These groundbreaking innovations have ushered in smaller form factors and enhanced functionality, driving continuous progress in technology. This progress is fuelled by the myriad of semiconductor and packaging materials, which are making profound impact across a wide spectrum of applications.

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